i.Pile for Quality Control of Deep Foundations

Basic information

Product Description:
The Wafer Measuring System is a cutting-edge solution specifically designed for the wafer industry. This system offers precise measurements using a displacement-type non-contact coaxial laser displacement sensor. Its linear motor high precision gantry movement mechanism ensures accurate and smooth movements.

This system is compatible with various types of wafers, including polished, unpolished, transparent, and non-transparent. It can accommodate wafer samples ranging from 1-8 inches and can be extended to support larger 300mm (12 inch) products.

The inclusion of a coplanar air floating mobile bearing guarantees that the sample moves with exceptional flatness and smoothness. This ensures accurate measurements with high precision and reliability.

With this system, you can measure the thickness of a wafer ranging from 10 micrometers to 20 millimeters. Its maximum scanning speed reaches 1 meter per second, enabling efficient and timely measurements.

Moreover, the Wafer Measuring System offers a comprehensive range of measurement parameters and standards. It can accurately analyze thickness (TTV), local thickness variation (LTV), total indicator reading (TIR), surface orientation (Sori), taper, bow, and warp. This makes it a versatile tool for quality control and research in the wafer industry.

With its advanced technology and wide range of capabilities, the Wafer Measuring System is an indispensable tool for precise and efficient wafer measurements in various applications within the industry.