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Basic information

Product Description:

Introducing our advanced Wafer Measuring System, designed specifically for the wafer industry. This cutting-edge system offers a range of features and capabilities to ensure precise measurements of various wafer types.

1. The system incorporates a displacement-type non-contact coaxial laser displacement sensor for accurate and reliable measurements.

2. It is equipped with a linear motor high precision gantry movement mechanism, ensuring smooth and precise movement during measurements.

3. Our Wafer Measuring System is compatible with both polished and unpolished, as well as transparent and non-transparent wafers, covering a wide range of measurement needs.

4. The system supports wafer samples ranging from 1 inch to 8 inches, with the option to extend its capacity to accommodate 12-inch (300mm) products.

5. With the coplanar air floating mobile bearing, the system guarantees extremely high flatness and smoothness, allowing the sample to move with utmost precision.

6. This system is designed to measure the thickness of wafers ranging from 10μm to 20mm, accommodating a wide range of wafer thicknesses.

7. It offers a maximum scanning speed of 1μm/s, enabling efficient and fast measurements.

8. Our Wafer Measuring System is versatile and can be applied to various measurement parameters and industry standards, including thickness (TTV), local thickness variation (LTV), total indicated runout (TIR), surface orientation (Sori), taper, bow, and warp.

Invest in our Wafer Measuring System for accurate and efficient measurements, meeting the industry's stringent requirements and ensuring optimal wafer quality.