ACS A1220 Monolith 3D

Basic information

Introducing the Wafer Measuring System, a cutting-edge solution specifically designed for the wafer industry. This advanced system offers a multitude of features to ensure precise and accurate measurements for a variety of wafer types.

1. Non-contact Coaxial Laser Displacement Sensor: The system leverages a displacement-type non-contact coaxial laser sensor for precise measurements. This sensor ensures high accuracy and reliable results.

2. Linear Motor High Precision Gantry Movement Mechanism: Equipped with a linear motor high precision gantry movement mechanism, this system guarantees smooth and precise movement during measurements. This mechanism enhances the overall accuracy and repeatability of the system.

3. Compatibility with Various Wafer Types: The Wafer Measuring System is capable of measuring both polished and unpolished, transparent and non-transparent wafers. This versatility enables users to measure a wide range of wafer samples according to their specific needs.

4. Wide Range of Wafer Sizes: With compatibility ranging from 1-8 inch wafer samples, this system caters to various wafer sizes commonly used in the industry. Additionally, it can be extended to accommodate larger 300mm (12 inch) products.

5. Coplanar Air Floating Mobile Bearing: The system utilizes a coplanar air floating mobile bearing, ensuring that the sample moves with exceptional flatness and smoothness. This enhances the accuracy and reliability of the measurements, even for delicate wafers.

6. Measurement Range: The Wafer Measuring System can measure the thickness of a wafer within a range of 10um to 20mm. This wide measurement range covers the majority of wafer thicknesses commonly found in the industry.

7. Maximum Scanning Speed: The system offers a maximum scanning speed of 1mu002Fs, enabling efficient measurements without compromising accuracy. This feature allows for faster processing and increased productivity.

8. Comprehensive Measurement Parameters: The system is equipped to measure various parameters, including thickness (T), total thickness variation (TTV), local thickness variation (LTV), total indicator reading (TIR), sori, taper, bow, and warp. It adheres to industry standards, ensuring compatibility and consistency in measurement results.