Evaluation Electronics -EIB 700

Category

• Measuring & Calibration Tool >> Instrumentation >> Goods >> Digital Display Devices
• Measuring & Calibration Tool >> Instrumentation >> Goods >> Coordinate Measuring Machines

Description

Introducing our cutting-edge Wafer Measuring System, designed specifically for the wafer industry. This revolutionary system is equipped with a displacement-type non-contact coaxial laser displacement sensor that ensures highly accurate measurements. The system features a robust linear motor high precision gantry movement mechanism, guaranteeing precise and smooth movements.One of the standout features of our Wafer Measuring System is its compatibility with both polished and unpolished, transparent and non-transparent wafers. It can effortlessly measure wafer samples ranging from 1 to 8 inches (which can be extended to 300mm or 12 inches). To maintain exceptional flatness and smoothness, we have incorporated a coplanar air floating mobile bearing, enabling the sample to move with utmost precision. The system can measure wafer thicknesses ranging from 10um to 20mm.With a maximum scanning speed of 1mu002Fs, our Wafer Measuring System offers rapid and efficient measurements. It is specifically designed to address various measurement parameters and standards such as thickness, TTV, LTV, TIR, Sori, Taper, Bow, and Warp. Invest in our advanced Wafer Measuring System today and elevate your wafer measurement processes to unprecedented levels of accuracy and efficiency.