Concrete Moisture Encounter 5 (CME5)
Cyprus,
Nicosia Diocese, Nicosia (Nicosia Diocese)
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Product Information
Order volume from: On request
Delivery terms: Pickup
Description
Introducing the Wafer Measuring System, a highly advanced tool designed specifically for the wafer industry. Here are the key features of this cutting-edge system:
1. Utilizes a displacement-type non-contact coaxial laser displacement sensor for precise measurements.
2. Incorporates a linear motor high precision gantry movement mechanism for accurate and smooth movement.
3. Supports measurements of both polished and unpolished, transparent and non-transparent wafers.
4. Compatible with wafer samples ranging from 1-8 inches, with the ability to extend to 300mm (12 inches).
5. Features a coplanar air floating mobile bearing system, ensuring the sample moves with exceptional flatness and smoothness.
6. Enables measurement of wafer thickness ranging from 10um to 20mm.
7. Boasts a maximum scanning speed of 1mu002Fs, facilitating efficient and timely measurements.
8. Offers comprehensive measurement parameters and standards, including thickness, TTV, LTV, TIR, Sori, Taper, Bow, and Warp.
The Wafer Measuring System sets a new standard in precision and versatility, meeting the demands of the wafer industry with ease. Experience unparalleled accuracy and efficiency in your wafer measurements with this state-of-the-art system.