Assembly COB Processes
Germany,
Berlin Land, Berlin
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Product Information
Order volume from: On request
Delivery terms: Pickup
Description
Introducing our highly advanced product, the HDIu002Fmicrovia substrates in flex, rigid-flex, and rigid technology. These substrates are specifically designed for high-frequency and high-temperature applications, making them ideal for industries with demanding requirements.Our microfluidic substrates offer precise control and manipulation of fluids in various applications. With a comprehensive range of base materials, constraining materials, and surface finishes, our substrates can be customized to meet your specific needs.What sets our product apart is its enhanced features, including embedded passives, wrap-around designs, and cavities. These features enable greater functionality and versatility in your applications.In addition, our chip-on-flex (COF) and chip scale packaging (CSP) substrates provide compact and efficient solutions for integrated circuits. These substrates are crucial in industries where space is limited.For applications requiring exceptional durability and reliability, our LCP (Liquid Crystal Polymer) substrates are the perfect choice. These substrates offer exceptional thermal stability and mechanical strength, enabling them to withstand harsh conditions.With our highly complex HDIu002Fmicrovia substrates, you can expect exceptional performance and reliability. Experience the difference in your high-frequency, high-temperature, and microfluidic applications with our top-of-the-line substrates.