Business
Business
Business
Commercial Property
Investment
Franchise
Equipment
Heavy Equipment
Tenders
Services
Goods
Services for employers
Job Seeker Services
Posting Listings
Placement in the directory of companies
Professional packages
Services for employers
Services for jobseekers/freelancers
3. DBC (Direct Bondet Copper)
Germany, Berlin Land, Berlin - view exact location
Product Information
Order volume from: On request
Delivery terms: Pickup
Description
The DBC (Direct Bonded Copper) technique is a specialized process that involves directly bonding copper foil with al2o3 or AlN (on one or both sides) at high temperatures. This results in the creation of a super-thin DBC substrate that offers outstanding electrical isolation, high thermal conductivity, excellent solderability, and strong bonding strength.The DBC ceramic substrate can be structured similarly to a PCB, allowing for etched wiring. It also has a high current loading capability, making it an ideal base material for the construction and interconnection techniques of high power semiconductor electronic circuits. Additionally, it serves as the foundation for chip-on-board technology, which represents the packaging trend of the century.Specifications:- Metallization thickness: 25 ±10um- Nickel thickness: 2~10um- Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
