Slicing into wafers
Bulgaria,
Sofia Province, Sofia
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Product Information
Order volume from: On request
Delivery terms: Pickup
Description
We specialize in the production and manufacturing of high-quality wafers for various industries. Our wafers are carefully sliced from crystal materials using state-of-the-art sawing machines with diamond impregnated blades. With a monthly capacity of 2500 kg, we can accommodate a wide range of orders from our customers.
Our slicing machines are equipped to handle wafers with a maximum diameter of Ф152 mm and a thickness of up to 80 mm. We take precision seriously, ensuring a slicing accuracy of ± 25 microns. This level of accuracy is crucial for industries that require precise measurements and uniformity in their wafer products.
As a trusted manufacturer and producer, OPSIL LTD is committed to delivering wafers that meet the highest standards of quality. Whether you are in the semiconductor, electronics, or any other industry that relies on wafers, our products will meet your specific requirements.
For more information or to place an order, please contact us through email or by using the contact details provided. We look forward to serving your wafer needs.