SINEAX VS54

Basic information

Introducing our advanced Wafer Measuring System, designed specifically for the semiconductor industry. This state-of-the-art system offers precise measurements using a displacement-type non-contact coaxial laser sensor. Featuring a linear motor high precision gantry movement mechanism, it ensures accuracy and reliability.

Our Wafer Measuring System is compatible with both polished and unpolished, transparent and non-transparent wafers, making it versatile for various applications. It can accommodate wafer samples ranging from 1-8 inches and can even be extended to accommodate 300mm (12 inch) products.

Equipped with a coplanar air floating mobile bearing, this system guarantees extremely high flatness and smoothness, ensuring that your samples move effortlessly. It can measure the thickness of a wafer in the range of 10um to 20mm, providing precise and reliable results.

With a maximum scanning speed of 1 micron per second, our Wafer Measuring System is efficient and time-saving. It is also equipped with advanced software capabilities, allowing for measurement parameters and standards such as thickness, TTV, LTV, TIR, Sori, Taper, Bow, and Warp.

Invest in our high-quality Wafer Measuring System to enhance precision and efficiency in your semiconductor processes. Experience accurate measurements and advanced features designed to meet the demands of the industry.