SINEAX VS46

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Introducing our cutting-edge Wafer Measuring System, designed specifically for the wafer industry. This advanced technology offers a range of features to ensure precise and accurate measurements.

Equipped with a displacement-type non-contact coaxial laser sensor, our system guarantees reliable measurements. The linear motor high precision gantry movement mechanism ensures smooth and precise movement during the measurement process.

Versatility is key, which is why our system is compatible with both polished and unpolished, transparent and non-transparent wafers. It can accommodate wafer samples ranging from 1-8 inches, and can even be extended to 300mm (12 inch) products.

To ensure optimal accuracy, our system incorporates a coplanar air floating mobile bearing. This innovative feature ensures that the sample moves with exceptional flatness and smoothness throughout the measurement process.

With a wide measuring range, our system can measure the thickness of wafers ranging from 10um to 20mm. Additionally, it boasts a maximum scanning speed of 1mu002Fs, ensuring efficient and timely measurements.

Our Wafer Measuring System also offers a comprehensive set of measurement parameters and standards. It is capable of measuring various parameters including thickness, TTV, LTV, TIR, Sori, Taper, Bow, and Warp, providing a complete analysis of the wafer's characteristics.

Invest in our Wafer Measuring System to streamline and enhance your wafer measurement processes. With its advanced technology and precise measurements, our system is the perfect solution for the wafer industry.