3. DBC (медь прямого соединения)

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The DBC (Direct Bonded Copper) technique is a specialized process that involves directly bonding copper foil with al2o3 or AlN (on one or both sides) at high temperatures. This results in the creation of a super-thin DBC substrate that offers outstanding electrical isolation, high thermal conductivity, excellent solderability, and strong bonding strength.The DBC ceramic substrate can be structured similarly to a PCB, allowing for etched wiring. It also has a high current loading capability, making it an ideal base material for the construction and interconnection techniques of high power semiconductor electronic circuits. Additionally, it serves as the foundation for chip-on-board technology, which represents the packaging trend of the century.Specifications:- Metallization thickness: 25 ±10um- Nickel thickness: 2~10um- Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)