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Великобритания, Англия, Большой Лондон, Лондон - посмотреть точное местоположение

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Условия доставки: Самовывоз

Описание

Introducing our innovative Wafer Measuring System, designed specifically for the wafer industry. This cutting-edge system employs a displacement-type non-contact coaxial laser displacement sensor for precise measurements. Equipped with a linear motor high precision gantry movement mechanism, this system ensures accuracy and reliability in all measurements.One of the remarkable features of our Wafer Measuring System is its compatibility with both polished and unpolished, transparent and non-transparent wafers. It can effortlessly handle wafer samples ranging from 1 to 8 inches, and can even be extended to accommodate 300mm (12 inch) products.To guarantee optimal performance, the system integrates a coplanar air floating mobile bearing technology, which promotes exceptionally high flatness and smoothness during sample movement. This ensures that measurements are taken with the utmost precision and reliability.With the ability to measure wafer thickness ranging from 10um to 20mm, our Wafer Measuring System caters to a wide range of sample sizes. Furthermore, its maximum scanning speed of 1mu002/fs ensures efficient and swift measurements.Designed to meet industry standards, our advanced system is capable of analyzing various parameters such as thickness, TTV, LTV, TIR, Sori, Taper, Bow, and Warp. This comprehensive functionality enables our system to address a multitude of measurement needs in the wafer industry.Invest in our state-of-the-art Wafer Measuring System and experience unparalleled precision, reliability, and efficiency in wafer measurements.