CMEX5 - Medidor de Umidade em Concreto X5

Informação básica

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Introducing the Wafer Measuring System, a cutting-edge tool designed specifically for the wafer industry. With its advanced features, this system ensures accurate and efficient measurements of various types of wafers.

1. The system utilizes a displacement-type non-contact coaxial laser displacement sensor for precise measurement.
2. It incorporates a linear motor high precision gantry movement mechanism, enabling smooth and precise movement.
3. The system is compatible with both polished and unpolished, transparent and non-transparent wafers, making it versatile for different applications.
4. It supports wafer samples ranging from 1 to 8 inches in size (expandable to 300mm or 12 inches).
5. The inclusion of a coplanar air floating mobile bearing ensures that the sample moves with exceptional flatness and smoothness.
6. It is capable of measuring the thickness of a wafer within the range of 10um to 20mm.
7. The maximum scanning speed of the system is an impressive 1mu002Fs.
8. This system is equipped to measure various parameters such as thickness (TTV), localized thickness variation (LTV), total indicated runout (TIR), surface orientation (Sori), taper, bow, and warp, using standardized measurement protocols.

In summary, the Wafer Measuring System is a state-of-the-art solution designed to meet the demanding requirements of the wafer industry. Its precision, versatility, and comprehensive measurement capabilities make it an essential tool for wafer production and quality control processes.