DSAL - Dec Scanner - DSAL - Dez-Scanner

Grundinformation

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Introducing our advanced Wafer Measuring System, a cutting-edge technology specifically designed for the wafer industry. This system offers a range of impressive features and functionalities to ensure precise and accurate measurements:

1. Utilizes a displacement-type non-contact coaxial laser displacement sensor for measurement purposes.
2. Equipped with a linear motor high precision gantry movement mechanism for smooth and accurate positioning.
3. Compatibility with various types of wafers including polished, unpolished, transparent, and non-transparent.
4. Capable of accommodating wafer samples ranging from 1-8 inches in size, with the option to extend to larger 300mm (12 inch) products.
5. Features a coplanar air floating mobile bearing system that guarantees exceptional flatness and smoothness during sample movement.
6. Able to measure wafer thicknesses ranging from 10um to 20mm.
7. Boasts a maximum scanning speed of 1mu002Fs, ensuring efficient and time-saving measurements.
8. Specifically designed to analyze and measure various parameters and standards including thickness, TTV (Total Thickness Variation), LTV (Local Thickness Variation), TIR (Total Indicated Runout), Sori, Taper, Bow, and Warp.

This Wafer Measuring System is the ideal solution for the wafer industry, allowing for precise and comprehensive analysis of wafer samples. Its advanced features and versatility make it a valuable asset for businesses operating in this industry.