ملحقات قياس الضوضاء وملحقاتها

معلومات اساسية

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Introducing our advanced and innovative Wafer Measuring System, designed specifically for the wafer industry. With its cutting-edge features and technology, this system ensures accurate and precise measurements for various types of wafers.One of the key features of our system is the measurement of displacement-type non-contact coaxial laser displacement sensor. This sensor guarantees precise and reliable measurement results. Additionally, our system is equipped with a linear motor high precision gantry movement mechanism, ensuring smooth and accurate movement during measurements.Our system is compatible with both polished and unpolished wafers, as well as transparent and non-transparent ones. It can handle wafer samples ranging from 1 to 8 inches, and can be extended to accommodate larger 300mm (12 inch) products.To ensure the highest level of precision, our system utilizes a coplanar air floating mobile bearing. This technology guarantees that the sample moves with exceptional flatness and smoothness, resulting in accurate measurements. With a measurement range of 10µm to 20mm, our system is versatile and capable of handling various wafer thicknesses.When it comes to speed, our system excels with a maximum scanning speed of 1µm/s. This allows for efficient and timely measurements, saving valuable time in the production process.Our Wafer Measuring System is specifically designed to meet the needs of the industry. It can measure various parameters such as thickness, TTV, LTV, TIR, Sori, Taper, Bow, and Warp. Additionally, it adheres to industry standards for measurement, ensuring accuracy and reliability.Invest in our Wafer Measuring System and experience the next level of precision and efficiency in wafer measurements. Improve your production processes with reliable and accurate measurements, ultimately enhancing the quality of your products.